SMT Hybrid Packaging 2016 – New Highlights and priority areas within the hall

Visitors to the SMT Hybrid Packaging trade fair, the International Exhibition and Conference for System Integration in Micro Electronics, can look forward to a diverse program and new highlights this year. They experience the whole variety of assembly production from 26 – 28 April 2016 in Nuremberg, Germany.

Hall layout along the value chain

The new hall layout introduced last year has been well-received. Due to its success, the concept will be continued on this path. Providing a supporting guideline for all attendees, the priority areas following the value chain and are structured as follows:

  • In hall 6, the topics “System Development and Production Preparation” as well as “Materials and Components” will be presented.
  • In hall 7, the visitors will find all about “Processes and Manufacturing”.
  • The new hall 7A showcases the topics “Reliability and Test” and “Software and Production Control”.

Experience production steps “live”

Yet another highlight at this year’s event is the production line called “Future Packaging”. It is organized by the Fraunhofer (IZM) and operating under the slogan: “Living the digital age: Work and home in a networked world”. The highlight: The expert audience can see individual production steps during the exhibition. This permits interested visitors to convince themselves of the efficiency of the machines under realistic conditions directly on-site.

New: “Optics meets Electronics” in hall 7A

For the first time the joint stand “Optics meets Electronics”, led by Fraunhofer (IZM), is offering products and solutions from the optoelectronics sector and this year located in hall 7A. Exhibitors present products, solutions and services in the field of “Automotive Communications”, “Optical Sensors and Sensor Systems”, “Optical Communications”, “Optical Analysis and Detection” and “Optical Process Management”.

The ‘High Tech PCB Area’ introduced successfully last year will be brought together with the ‘EMS Intersection’ which has been established for years. Exhibitors and visitors to SMT Hybrid Packaging 2016 can look forward to great synergy from the partnership, which will be enhanced by a shared Expert Forum.

The unique concept of SMT Hybrid Packaging covers the whole process chain from initial idea to development and design as well as manufacturing of assembly production.

Additional information is available at or from the organizer Mesago Messe Frankfurt at


Start typing and press Enter to search