SMT Hybrid Packaging 2017: Trend-setting exhibition with great experiences is opening soon
The countdown for this year ́s SMT Hybrid Packaging is running: From 16 – 18 May 2017 the organizer Mesago Messe Frankfurt GmbH expects over 410 exhibitors and many qualified visitors in the new halls 4, 4A and 5 of the Nuremberg exhibition center. Attendees can look for informative expert talks with exhibitors, gain more knowledge and intensify their network within the industry. Besides an extensive service and product variety many highlights are available.
Production line “Future Packaging”: “… And Hardware for all”
The exhibition experience for visitors starts in hall 5, booth 434, on the worldwide unique production line “Future Packaging” organized by Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany. On over 1,000 squaremeters the complete productions process is comprehensible with each single machine. There are several guided tours in German and English each day including a live production. The production line’s main theme is 2017 “… And Hardware for all”.
Forums give a noticeable lead in knowledge
In hall 5, visitors gain even more knowledge for their daily business. Two forums offer extensive possibilities for further education:
The EMS/PCB forum, booth 5-221A, concentrates on specialized lessons and presentations around the topics Electonics Manufacturing Services and the production of High Tech PCBs.
The exhibition forum on booth 5-306 is used by exhibitors as a presentation platform for their products, services and innovation potential. Moreover there are several papers and a panel discussion on the second day.
High Tech PCB Area and EMS-Intersection – concentrated PCB competence
Also located in hall 5 is the High Tech PCB Area. Companies who are dealing with high-technologized PCBs show their know-how. Due to the local concentration of the companies, visitors can get an overview of innovations and special solutions within a minimum of time.
The thematically related joint stand EMS-Intersection is quite next to the High Tech PCB Area. Here providers of Electronics Manufacturing services present their portflio. The concept of the joint stand enables a qiuck and direct comparison of several EMS-companies.
Optical technologies in microelectronics – focus topic with own joint stand
What does the emerge of optical technologies in microelectronics mean and what solutions are offered? During their tour through the exhibition, visitors can get informed about these questions at the joint stand Optics meets Electronics in hall 4, stand 239. The exhibitors are dealing with the following key topics: electro-optical packages, modules and assemblies, optical interfaces and materials as well as production technologies and equipment. The joint stand is conceptually cared by Fraunhofer IZM.
Observe Europe ́s best hand solderers during their work
A great highlight in hall 4 is the hand soldering competition of IPC: On booth 400 the best skills in hand soldering complex printed board assemblies are recognized. The high density printed boards demand highly skilled operators to ensure a zero-defect soldering process.
Hall 4A in focus: Reliability and Test as well as Software and Production control
The exhibition tour along the value added chain ends in hall 4A. Here, visitors can find numerous exhibitors who are offering their services in the subject area testing and reliability as well as the more general topics software and production control.
New: Event app for more orientation onsite
Besides the new reworked exhibition guide, an event app is available for the first time in 2017. This includes the hall plans, the exhibitor list, the forum and conference program and further useful information. Moreover there will be a free WiFi in the halls.
Interested visitors can register for a free day ticket at smthybridpackaging.com/tickets.