SMT shows new reflow generation at the SMT/Hybrid/Packaging
Under the motto “SMT – Innovation creates future”, SMT Thermal Discoveries presents as an absolute highlight its newly developed reflow soldering system SMT QuattroPeak ® 3.6. In modern design with new options in the operating software, SMT points the way to the Smart SMT Factory from the standpoint of Industry 4.0 and impresses with the usual extremely low energy consumption.
There are further innovations at the award-winning SMT vacuum reflow soldering system. SMT puts its longtime know-how, as a leading manufacturer with more than 110 vacuum soldering systems sold, into the progress of the system. The optimized transport transfer, the cycle time improvement and the heavy load transport with optimized profile coating are presented at the system.
SMT demonstrates a high degree of flexibility in transport with its curing system SMT HTT. With 1-track to x-tracks, up to two transport levels, heavy-load transport (up to 50 kg / m) and bi-directional conveyor (Lean concept), the system can be customized to customer requirements.
With the SMT Cube, SMT is showing another facility that is awarded the “Global Technology Award”. The temperature control system is designed for the temperature pre-treatment of the electronic components and modules for function tests. The highlights of the system are the small footprint and the Lean concept, which allows loading and unloading at one place.
SMT Hybrid Packaging, booth 4-149