SMTconnect: Call for Papers opened for new Technology Days

5145_0188.jpgParallel to the SMTconnect exhibition, the new SMTconnect Technology Days will focus on mounting and connecting technologies in a wide variety of user sectors. Interested experts can submit their abstracts by 12 December 2018. The aim of the Technology Days is for specialists to pass on their knowledge in practice-oriented seminars and special sessions. Topics include soldering, substrate and adhesives technologies.

Technology Days – heading into the future with practice-oriented topics

The new knowledge platform will be taking place on three days, entirely devoted to the mounting and bonding of components and assemblies. These are structured as follows:

– Day 1: Soldering technologies – Day 2: Substrate technologies – Day 3: Adhesives technologies

Participants of the Technology Days can learn more about new developments in material and technology, possible problems and their solutions, as well as find out what specific applications require with regard to quality and reliability.

“With the new Technology Days, we are focusing on mounting and connecting technologies in a wide variety of microelectronics applications and offering participants targeted contributions that do not lose sight of practical relevance,” describes Anthula Parashoudi, Vice President of SMTconnect at Mesago Messe Frankfurt GmbH.

Calling the driving forces of the industry – Call for Papers

Until 12 December 2018, experts in the field of mounting and connecting technologies have the opportunity to submit their abstract in English or German. If selected by the committee, they will have the opportunity to inspire a highly qualified circle of participants with their latest developments and research results at the first SMTconnect Technology Days.

The contributions should have a practical relevance or provide forward- looking insights into one of the three topic areas: Soldering technologies, substrate technologies or adhesives technologies.

The speakers can choose from two different formats. On the one hand, practice-oriented seminars will be offered in which technical and special knowledge (for example, connecting techniques), practical examples and solution strategies can be presented in 1.5 or 3 hours. On the other hand, there will be trend-setting special sessions, which will deal with future and market trends, current facts and figures as well as research results in timeslots of 25 minutes.

In addition to the SMTconnect Technology Days, the accompanying exhibition in Nuremberg from 7 – 9 May 2019 will offer an established information- and discussion platform for customized solutions for electronic assemblies and systems.

Information on the submission conditions and the selection procedure for contributions can be found online.

www.smtconnect.com

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