Speedprint showing in-printer dispensing at SMTAi 2016

Speedprint ADU+ dispense moduleSMTAi Booth #729: Global stencil printing specialist Speedprint Technology will be showing its ADu+ dispensing module integrated into the SP710 printer platform and participating in the Tech Tour at SMTA International in September.

In-printer dispensing offers significant advantages to manufacturers. Speedprint’s ADu+ provides dual syringe dispensing – one for solder paste, one for glue. Importantly, the ADu+ can dispense lines as well as traditional dots of material: functionality that can prove critical for affixing RF shields or cans.

Some of the many other applications include rapidly handling PCB engineering changes by dispensing paste on to new pads without modifying the stencil (also ideal for prototyping), dispensing fresh paste on pads for rework, dispensing adhesive post-print for robust component attach at placement, and dispensing underfill materials after placement.

You can see Speedprint’s ADu+ in action on booth #729 at SMTAi and as part of the organisation’s popular Tech Tour, where you can talk about the many productivity benefits of in-printer dispensing with VP Americas Mark Brawley and Product Manager Chris Whitfield.

SMTA International takes place from 25 to 29 September at the Donald Stephens Convention Center, Rosemont, IL.

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