TDK to preview equipment front end module at SEMICON West 2016
TDK Corporation, a leader in factory automation systems, will exhibit its new Self-circulating Nitrogen Purge Equipment Front End Module (EFEM) at SEMICON West, July 12-14, 2016 at the Moscone Convention Center in San Francisco, CA. Visitors can go to the TDK booth #2405 in the South Hall to see a demonstration of this new technology.
The N2 EFEM CAVS-NE uses a sealed enclosed frame with integrated TDK Load Ports that provides a low O2 and humidity environment for FAB wafer processing. “The TDK design ensures that wafers are never exposed to the atmosphere during transport between the FOUP and load lock,” said Kiyoshi Kanashiro, Factory Automation Manager. “This is the first kind of this type of idea in the industry and can provide a major wafer yield improvement to our customers.”
In addition, the company will demonstrate its TAS300 J1 Load Port wafer transport system for 300 mm diameter wafers.
We will also have video presentation of TDK high precision AFM 15 Thermosonic and Thermal Compression Flip Chip Die Bonders. TDK flip chip die bonder uses a micro scrub process to lower energy required and reduce cycle time for die attach process. TDK micro scrub process eliminates flux.