TopLine CEO Martin Hart to present PID Vibration Cancellation Particle Damping Paper at Space Tech Expo 2018
TopLine Corporation will exhibit its innovative PID vibration cancellation particle damping technology, originally developed by NASA, in a paper presented by CEO Martin Hart at the West Coast’s 2018 Space Tech Expo show May 22-24 in Pasadena, California, USA. Space Tech Expo USA is America’s engineering and manufacturing meeting place for space technology. The show will be held at the Pasadena Convention Center, 300 E. Green St., Pasadena, CA 91101. Martin Hart’s presentation will be on May 23 and is targeted to the Mil-Aero Defense Industry.
Patented PID technology has been well-received by engineers who have been looking for a way to mitigate or curb the harmful effects of random vibration in electronic components and assemblies. Particle Impact Dampers reduce harmful vibration and extend hardware life and reliability. TopLine has created a new web site showing a 2-minute YouTube video showing how the PID works; Please visit www.Vibration.Engineering for more information.
PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field. PID can be solder attached like ordinary electronic components or attached to the board using permanent epoxy adhesive. TopLine’s Particle Impact Dampers were invented at NASA’s Marshall Space Flight Center.
TopLine, exhibiting in Booth 5023, will show other solutions that include CCGA – Column Grid Arrays, and daisy chain BGA test vehicles. CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
For more information about the show, visit http://www.spacetechexpo.com