TopLine exhibiting CCGA, solder joint reliability solutions at SMT/Hybrid/Packaging Nuremberg May 16-18
TopLine will exhibit for the 20th straight year at SMT/Hybrid/Packaging Exhibition in Nuremberg, Germany, May 16 -18, 2017 in Stand #A4-120.
Featured TopLine products will include CCGA – Column Grid Arrays and daisy chain BGA test vehicles. CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs), and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
SMT Hybrid Packaging, held at Exhibition Centre Nuremberg, Messezentrum, 90471 Nuremberg, Germany is a prestigious professional trade platform and exhibition of SMT (Surface Mount Technology) and hybrid semiconductors and semiconductor packaging. SMT/Hybrid/Packaging 2017 brings together more than 420 exhibitors from the electronics manufacturing industry around the globe with innovative equipment, materials, and system integration solutions.
TopLine has been active in promoting its products in the European market for 28 years.