TopLine exhibiting CCGA, Solder Joint Reliability Solutions at Space Tech Expo May 23-25 in Pasadena, California
TopLine Corporation will exhibit its innovative CCGA technology and solder joint reliability solutions in booth #8023 at the Space Tech Expo show May 23-25, 2017 in Pasadena, California, USA. Space Tech Expo USA is America’s engineering and manufacturing meeting place for space technology. The show will be held at the Pasadena Convention Center, 300 E. Green St., Pasadena, CA 91101.
Featured TopLine products will include CCGA – Column Grid Arrays and daisy chain BGA test vehicles. CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs), and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
CCGAs reduce stress caused by CTE mismatch, thereby increasing reliability of semiconductor components for space, mil/aero, down-hole drilling and special automotive and medical applications. CCGA technology increases life for FPGA (Field Programmable Gate Arrays). CCGAs are better than BGAs for rugged operating environments.