TopLine Exhibits CCGA Solder Joint Reliability Solutions at INTERNEPCON, Tokyo, January 16-18 2019

TopLine will exhibit its innovative CCGA technology and other packaging solutions at the 48th INTERNEPCON Japan, Tokyo, 16 – 18 January 2019, in Booth E13-14.

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TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” stated TopLine CEO Martin Hart. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co;

INTERNEPCON JAPAN will be held inside NEPCON JAPAN 2019 at Tokyo Big Sight. The show and technical conference is recognized as the world’s leading SMT Exhibition, gathering equipment, solutions and services for Electronics Manufacturing. For more information about the show, visit https://www.nepconjapan.jp/en-gb/about/exhibits/internepcon-japan.html

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