TopLine sponsors IMAPS Wire Bonding Conference
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
“The objective of the Wire Bonding Workshop is to bring together scientists, engineers, manufacturing, academia and business people from all over the world,” Hart said. “In prior years, the workshop has been an excellent venue for presenting and debating the latest and hottest technologies related to the use of wire bonding in semiconductor and microelectronics packaging.”
The Wire Bonding Workshop organizing committee includes representatives from Tanaka, SPT, Palomar, K&S, ASM, Heraeus, Hesse Mechatronics, F&K and MPP Tools to guide the event. The new format is a one-day intensive workshop with presentations by 12 industry experts in the field of wire bonding for the microelectronics industry. IMAPS is calling for abstracts to be submitted by March 30.
TopLine provides universities and microelectronic laboratories with off-the-shelf distribution of Tanaka’s full range of bonding wire including gold, silver, copper and aluminum. Wire sizes from 12um to 500um diameter. The offering includes flat gold ribbon for RF and high-power applications.