TopLine to exhibit CCGA and PID technologies at NEPCON South China 2018
TopLine will exhibit its groundbreaking CCGA and PID component technologies at the upcoming NEPCON South China 2018 conference and exposition, at the Shenzhen Exhibition Center, August 28 – 30, in Stand #1F13. This marks the 6th straight year that TopLine has exhibited at this show; TopLine has been active in promoting its products in the China market for more than 20 years.
Featured products will include CCGA – Column Grid Arrays and PID (Particle Impact Dampers) technology. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html.
Particle Impact Dampers (PID) reduce harmful vibration and extend hardware life and reliability. PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field. PIDs can be solder attached like ordinary components or attached to the board using permanent epoxy adhesive. TopLine’s Particle Impact Dampers were invented at NASA’s Marshall Space Flight Center. TopLine has created a web site with a 2-minute YouTube video showing how the PID works; Please visit www.Vibration.Engineering.
NEPCON South China 2018 will be held at the Shenzhen Exhibition Center, August 28 – 30. The event brings together nearly 650 leading local and international brands, as well as more than 50,000 business managers and procurement decision makers from the OBM, OEM and ODM sectors across the electronics industry.