TRI brings the future of inspection to NEPCON China 2016

TRITest Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON China 2016 exhibition. Visit us at booth 1H38 in Hall 1 of Shanghai World Expo & Convention Center from April 26 ~ 28, 2016 and discover the leading Industry 4.0 solutions for PCBA inspection.

Premiered at NEPCON China, TRI’s 2016 booth will feature an all new top-of-the-line 3D AOI system with advanced 3D solder fillet inspection designed for the most demanding industry applications. Also featured this year are high accuracy stop-and-go 3D SPI TR7007Q and all new TR5001 SII INLINE Multi-Core Parallel ICT. The complete inspection lineup includes CT-capable 3D AXI system TR7600XLL SII CT, TRI’s unique hybrid AOI TR7700 SII Plus, and TRI’s acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.

Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at NEPCON CHINA booth 1H38 for a personal tour of TRI’s acclaimed solution lineup.


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