TRI brings the future of inspection to IPC APEX 2016

TR7700QI_20151118Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at IPC APEX 2016 exhibition held in Las Vegas, Nevada. Visit us at booth 1134 of Las Vegas Convention Center from March 15 ~ 17, 2016 for a personal tour of the latest developments in PCBA inspection.

TRI’s 2016 portfolio includes new mid-range TR7700QI stop-and-go 3D AOI system 3D solder fillet inspection designed for high-mix productions including mobile and PC applications. Also launching in 2016 are high accuracy stop-and-go 3D SPI TR7007QI and all new TR5001 SII INLINE Multi-Core Parallel ICT. The complete inspection lineup includes CT-capable 3D AXI system TR7600 SII CT and TRI’s acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.

Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at IPC APEX booth 1134 for a personal tour of TRI’s acclaimed solution lineup.


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