TRI hosts 2017 Innovation Seminars in Taiwan, Suzhou and Shenzhen
TRI Hosts 2017 Innovation Seminars in Taiwan, Suzhou and Shenzhen
Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a series of technology seminars held in Shenzhen, Suzhou and Taiwan. Each of the one-day events will focus on latest technology innovations in TRI’s comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 smart manufacturing.
TRI’s 2017 lineup features high performance CoaXPress upgrades to 3D AOI and 3D SPI solutions the TR7500QE and TR7007Q series. Also launching in 2017 is TR7600 SIII, TRI’s new generation inline 3D CT AXI with line-speed high accuracy inspection and Multi-Core Parallel ICT series TR5001 SII with a complete range of inline and standalone configurations.
Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.
To register for any of the seminars, please contact your TRI sales representative.