TRI hosts 2018 Innovation Seminar in Penang, Malaysia

Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a technology seminar held in Penang, Malaysia. The one-day event will focus on the latest technology innovations in TRI’s comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 smart manufacturing.

TRI’s 2018 lineup features high performance CoaXPress upgrades to 3D AOI and 3D SPI solutions, the TR7500QE and TR7007D series. Also showcasing TR7700Q, TRI’s new cutting-edge inline 3D DFF AOI for high accuracy inspection and Multi-Core Parallel ICT series TR5001Q SII INLINE with a complete range of inline and standalone configurations.

Location Date Venue
Penang, Malaysia May 17, 2018 Eastin Hotel Penang

Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.
To register for the seminar, please contact your TRI sales representative.


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