TRI premieres new inspection solutions at NEPCON South China 2016
Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON South China 2016 exhibition. Visit us at booth C22 in Hall 1 of Shenzhen Convention & Exhibition Center from August 30 ~ September 1, 2016 for a personal tour of the latest developments in TRI’s award-winning solutions for PCBA inspection.
TRI’s 2016 new lineup introduces the TR7500QE stop-and-go 9D AOI system designed for best inspection coverage with maximum accuracy with 2D+3D clear image and accurate 3D solder inspection.
TR7007Q is a high performance 3D SPI system with 4 projectors, combining very high resolution imaging and intelligent software for detailed, reliable inspection of industry’s smallest SMT components.
Also launching in 2016 is a new multi-core ICT system, TR5001Q SII INLINE. Featuring up to 4-core parallel testing, the new in-circuit tester ’s intuitive programming application software and high performance hardware enable rapid testing and serial programming of up to 4 boards at once.
TR7500QE 3D AOI
Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth C22 in hall 1 for a personal tour of TRI’s solution lineup.