TRI reveals 2016 innovations at Seminars in Taiwan, Suzhou and Shenzhen



Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a series of technology seminars and product demos held in Shenzhen, Suzhou and Taiwan. Each of the one-day events will focus on latest technology innovations in TRI’s comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 data-driven manufacturing.

TRI’s 2016 portfolio includes new TR7700QI stop-and-go 3D AOI system with 3D solder fillet inspection designed for high-mix high-volume productions including mobile and PC applications. Also launching in 2016 are high accuracy stop-and-go 3D SPI TR7007QI and all new TR5001 SII INLINE Multi-Core Parallel ICT. The complete inspection lineup includes CT-capable 3D AXI system TR7600 SII CT and TRI’s acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.

Location Date




March 23, 2016

Shangri-la Hotel, Shenzhen, 2F

深圳香格里拉大酒店 2 樓



March 25, 2016

Swissôtel Kunshan




March 31, 2016

TRI Production Center, Linkou

TRI 林口生產中心

Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0
data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.

To register for any of the seminars, please contact your TRI sales representative.


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