TRI’s smart factory solution features at NEPCON China 2017

Test Research, Inc. (TRI) will exhibit a comprehensive Smart Factory inspection solution, combining 3D SPI, 3D AOI, 3D AXI and multi-core ICT at NEPCON China 2017 exhibition. Visit us at booth 1H38 in Hall 1 of Shanghai World Expo & Convention Center from April 25 ~ 27, 2017 and discover the leading one stop solution for PCBA inspection.

TRI’s One Stop Solution is a complete answer to electronics industry’s push for Smart Factory production. Designed along Industry 4.0 principles, the integrated YMS 4.0 solution collects and analyzes inspection data across the production line to optimize output, increase yields and automate production quality management.
The 2017 TRI lineup will feature TR7700QE top-of-the-line 3D AOI with advanced 3D solder fillet inspection, and TR7500 SIII 3D high performance 3D AOI, designed for zero-escape industry applications. Also featured this year are TR7007Q stop-and-go 3D SPI and all new TR5001D SII INLINE multi-core ICT. The complete inspection lineup includes high resolution 3D CT AXI and acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.

Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize quality costs. Visit us at NEPCON China booth 1H38 for a personal tour of TRI’s acclaimed solution lineup.


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