TRI’s to unveil one stop solution for SMT lines at NEPCON South China 2018
Test Research, Inc. (TRI) will exhibit a comprehensive Smart Factory Inspection solution for PCB and SMT lines, combining 3D Solder Paste Inspection (SPI), 3D Automated Optical Inspection (AOI), 3D Automated X-ray Inspection and Multi-Core ICT at NEPCON South China 2018 exhibition. Visit us at booth 1H55 in Hall 1 of Shenzhen Convention & Exhibition Center from August 28 – 30, 2018 and discover the leading One-Stop Solution for PCBA Inspection.
The 2018’s TRI lineup for NEPCON South China will include award-winning TR7700Q 3D AOI with leading-edge solder fillet inspection and TR7500QE high-performance 3D AOI, designed for Zero-Escape Industry Applications. TRI’s cutting-edge 3D SPI TR7007Q with the leading Optical Resolution of 5.5µm Stop-and-Go 3D SPI and Revolutionary SPI solution TR7007 SII Plus. TRI’s lineup will also include first-class 5µm High-Resolution 3D CT AXI TR7600F3D and TR7600 SIII. TRI’s all new TR5001Q SII INLINE Multi-core ICT and TR5001T SII TINY will be both featured during the exhibition.
Discover how TRI’s PCBA Test and Inspection solutions work to bring you maximum value in the production line and minimize quality costs. Visit us at NEPCON South China 2018 booth 1H55 for a personal tour of TRI’s acclaimed solution lineup.