Update: SMT Hybrid Packaging 2018
With a growth of seven percent compared to the prior year, 80 percent of space at the SMT Hybrid Packaging 18 has already been booked. As Europe ́s leading platform for system integration in microelectronics, the SMT Hybrid Packaging is the ideal platform for companies to present their products and solutions – from the initial idea and its development, to the production of all technical processes during the manufacturing of electronic assemblies.
Special offer for new exhibitors – available once again in 2018
As a result of the positive feedback given on “Newcomer Pavilion”, the joint stand will again be organized in 2018. First-time exhibitors can benefit from a special offer allowing companies to cost-efficiently test the SMT Hybrid Packaging, with low organizational effort. Newcomer G-SMT Hungary confirms: “We are full of satisfaction. It was a great organization and it was a great place for the Newcomer Pavilion.”
Further attractive joint stands and special interest area
In addition to the Newcomer Pavilion, the Fair will hosting further exciting joint stands, as well as a special interest area.
PCB meets Components
PCBs, components and materials focusing on one area: the mixed double “PCB meets Components” incorporates the advancement of the proven High Tech PCB Area und brings together producers of PCBs and corresponding components.
Companies can participate individually or with a complete stand package on this special interest area.