Vi TECHNOLOGY will display 3D AOI system at SMT/Hybrid/Packaging
Vi TECHNOLOGY, a provider of inspection solutions for PCB assembly, is pleased to present K Series3D, its new 3D AOI, along with a complete range of inspection solutions at SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe exhibition center in Nuremberg, Germany. Visit Booth 7A-317 for a personal introduction.
K Series3D is the latest evolution of the successful K Series that has been delivering the most accurate component inspection to worldwide leaders in the electronics manufacturing industry for years.
By combining its extensive 2D AOI and 3D SPI experience with new proprietary technologies, the K Series3D delivers highly accurate all-around defect coverage including lifted components, lifted leads, tombstones, etc., for components up to 25 mm in height. Coupling high quality telecentric 2D images with dual camera blue-laser-based 3D profiles guarantees superior inspection quality for both pre-reflow and post-reflow.
K Series3D is also available as a cost-effective 3D AOI upgrade to existing 5K, 7K, and 9K systems.
Associated with 3D SPI – PI Series – and interconnected with SIGMA Link software suite, this whole 3D inspection solution is designed to satisfy the requirements of the most demanding PCB manufacturers excelling in the automotive, aerospace and defense sectors.