Viscom to exhibit powerful X-ray inspection lineup at NEPCON China 2016

Viscom NEPCON China 16Viscom presents the industry‘s most advanced and comprehensive range of high-performance X-ray inspection systems in booth #1J20 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World Expo Exhibition Center.

 The most comprehensive range of advanced X-ray inspection systems

At NEPCON China 2016, Viscom will showcase its most advanced lineup of 2-, 2,5- and 3-D inspection solutions with a focus on its unique range of cutting-edge X-ray inspection systems. From manual 3D microfocus X-ray computed tomography to fully automatic high-speed in-line 3D AXI systems, Viscom provides reliable and efficient solutions for all test gates. Intelligently integrated into the production line and using industry 4.0 inspection data, Viscom X-ray systems are ready for the future.

Full 3D – automatic, in-line, extremely fast

Highlighting its high-speed, full 3D inspection cababilities, Viscom will present its award-winning S3088 ultra XM 3D AOI. Equipped with the Viscom high efficiency XM 3D-camera module and fastflow transport, the S3088 ultra guarantees fast and reliable inspection of even the most challenging defects, down to 03015 type components, and the higly precise height measurement of components up to 25mm.

Additionally, visitors will have the chance to get a first look at Viscom’s latest development in full 3D X-ray inspection – the all new X7058 – which was especially developed for 100 percent top- and bottom-side, high-speed 3D X-ray inspection that will be rolled-out in Asia later this year.

 The world’s first and only combined in-line 3D AXI/3D AOI system

Equipped with Viscom’s high-speed XM camera-module the X7056RS is the only combined 3D AXI/3DAXI system on the market. Equipped with powerful digital flat panel detectors and X/Y stages, the new X7056RS FPD allows for even more accurate planar 3D analysis of hidden fine-pitch solder joints such as µBGA, QFNs and stacked packages (PoP), achieving an immense improvement in X-ray image quality.

 High resolution X-ray CT system X8011 with Viscom Quality uplink

Viscom’s future-oriented approach to manual X-ray inspection (MXI) is presented with the X8011 PCB. In addition to advantages such as the flexible adaptation to new requirements, the lengthy service life and brilliant image quality, this MXI-solution is known for its user-friendly compatibility with other inspection gates of Viscom, including solder paste inspection (SPI). Thus, all the data and results needed are available immediately. Whether it is AOI, SPI, AXI or MXI – the systems from Viscom are intelligently networked. Thus, the reasons for errors can be much better unlocked and processes can be optimized on the basis of comprehensive information.


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