Viscom presents advantages of 3D bond inspection at electronica
electronica, hall A3, stand 642 – With a wide range of inspection systems and camera modules, Viscom AG is offering outstanding solutions for fast, high-precision wire bond production inspections. At the electronica trade show in Munich from November 13-16, visitors can experience firsthand what 3D measurement contributes to product quality in this field.
The 3D inspection procedures which have long been standard at Viscom in the areas of optical inspection and X-ray inspection are now being used in quality assurance for wire bonds as well, and can be used to determine loop heights very accurately, for example. In order to demonstrate for the first time at Viscom’s electronica stand how 3D measurement results contribute to better inspection for defects in these products, a machine of the variably configurable type S6056BO was equipped with a new camera module. Designed specifically to handle the requirements of wire bond inspection, the module is based on the technologically proven 3D AOI modules XM and XMplus, which are used very successfully around the globe in the S3088 ultra gold und S3088 ultra chrome systems.
Bonds are used as jumpers in power electronics, for example. This is why they are integral parts of the ever-evolving storage batteries in the electromobility sector, among other things. As quality is particularly relevant to safety in this area, high standards are set for comprehensive, reliable inspections in production. In the area of wire bond inspection, Viscom offers a diverse range of high-performance hardware that includes various transport solutions for a range of substrates and workpiece carriers as well as intelligent software with adapted algorithms for reliable error/defect detection