Contamination, Cleaning and Coating Conference

May 22-24, 2017

Radisson Blu Hotel Amsterdam Airport Schiphol – Amsterdam, Netherlands

SMTA and SMART Group are excited to announce their first-ever co-organized conference in Europe. The conference focus is on contamination, cleaning and conformal coating in the manufacture of electronics. Be part of this two-day event featuring presentations, workshops, and a panel discussion.

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Technical Program:

Click here to view a printable PDF

Monday, May 22, 2017

Cleaning Printed Circuit Assemblies, Design & Process Control Workshop

1:00pm — 4:30pm


Bob Willis –
Helmut Schweigart, Ph.D. – ZESTRON
Mike Bixenman, DBA – KYZEN Corporation

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Tuesday, May 23, 2017

Tuesday Keynote Address

Prabjit Singh, Ph.D. IBM Corporation
Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers

Session 1: Residues trapped under Component Terminations

  • Karthik Vijay, Indium Corporation
  • Dendritic Growth & Corrosion under Low-Standoff Components in Automotive Electronics – A Flux Solution
  • Bruno Tolla, Ph.D., Kester
  • Impact of Reflow and Cleaning Conditions on the Electrochemical Activity of Flux Residues under Surface Mount Components
  • Mike Bixenman, DBA, KYZEN Corporation
  • Development of a Risk Profile from Flux Residues Trapped under Leadless Components
  • Bob Willis and Martin Wickham, NPL
  • Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
  • Vladimir Sitko, PBT Works
  • Cleaning Process Performance Measurement

Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

  • Doug Pauls, Rockwell Collins
  • Surface Insulation Resistance Testing to Best Simulate Humidity Exposure and Potential for Leakage Currents
  • Dave Hillman, Rockwell Collins
  • Flux Residues under Components – Are they Bad?
  • Eric Camden, Foresite
  • Electronic Assembly – Where do Contaminants come from?
  • Bart van de Lisdonk, Interflux
  • Chemical Reliability of Soldering Residue


Session 3: Process Control and Cleaning Material Innovations

  • Andreas Reinhardt, SEHO Systems GmbH
  • Measures to Minimize Contamination During Wave and Reflow Soldering
  • Rodrigo Aguilar, Inventec
  • Optimization of Chemistry for a Vapour Phase Process for Defluxing No-Clean Lead Free Materials
  • Mark Routley, GEN3 Systems
  • Process Control of Ionic Contamination achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
  • Todd Rountree, Austin American Technology
  • Addressing the Problems with Ionic Cleanliness Testing Modern Circuits

Wednesday, May 24, 2017

Wednesday Keynote Address

Rudiger Knofe, Siemens AG
Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal

Session 4: Conformal Coating Materials and Processes

  • Helmut Schweigart, Ph.D. ZESTRON
  • Selection of Protective Measures against Climatic Stress
  • David Foote, Nordson March
  • Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures without Impact on Coating Performance
  • Marie Kaing, Humiseal
  • Conformal Coating Materials for High Temperature Automotive Applications
  • Rakesh Kumar, Ph.D., Specialty Coatings
  • Challenges of Designing Electronics for Conformal Insulation to Enhance their Protection and Reliability
  • Eva Rogge, Euro Plasma
  • Innovative Plasma Coatings for High Volume Conformal Coating of Electronics
  • Michael Szuch, Nordson Asymtek
  • Transitioning from Manual to Automated Conformal Coating
  • Mathieu Gonsolin, Exelsius
  • Air Plasma at Atmospheric-Pressure for Improving Conformal Coating Reliability


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