Contamination, Cleaning and Coating Conference

May 22-24, 2017

Radisson Blu Hotel Amsterdam Airport Schiphol – Amsterdam, Netherlands

SMTA and SMART Group are excited to announce their first-ever co-organized conference in Europe. The conference focus is on contamination, cleaning and conformal coating in the manufacture of electronics. Be part of this two-day event featuring presentations, workshops, and a panel discussion.

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Technical Program:

Click here to view a printable PDF


Monday, May 22, 2017

Cleaning Printed Circuit Assemblies, Design & Process Control Workshop

1:00pm — 4:30pm

Instructors:

Bob Willis – bobwillis.co.uk
Helmut Schweigart, Ph.D. – ZESTRON
Mike Bixenman, DBA – KYZEN Corporation

Get details


Tuesday, May 23, 2017

Tuesday Keynote Address

Prabjit Singh, Ph.D. IBM Corporation
Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers

Session 1: Residues trapped under Component Terminations

  • Karthik Vijay, Indium Corporation
  • Dendritic Growth & Corrosion under Low-Standoff Components in Automotive Electronics – A Flux Solution
  • Bruno Tolla, Ph.D., Kester
  • Impact of Reflow and Cleaning Conditions on the Electrochemical Activity of Flux Residues under Surface Mount Components
  • Mike Bixenman, DBA, KYZEN Corporation
  • Development of a Risk Profile from Flux Residues Trapped under Leadless Components
  • Bob Willis and Martin Wickham, NPL
  • Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
  • Vladimir Sitko, PBT Works
  • Cleaning Process Performance Measurement

Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

  • Doug Pauls, Rockwell Collins
  • Surface Insulation Resistance Testing to Best Simulate Humidity Exposure and Potential for Leakage Currents
  • Dave Hillman, Rockwell Collins
  • Flux Residues under Components – Are they Bad?
  • Eric Camden, Foresite
  • Electronic Assembly – Where do Contaminants come from?
  • Bart van de Lisdonk, Interflux
  • Chemical Reliability of Soldering Residue

 

Session 3: Process Control and Cleaning Material Innovations

  • Andreas Reinhardt, SEHO Systems GmbH
  • Measures to Minimize Contamination During Wave and Reflow Soldering
  • Rodrigo Aguilar, Inventec
  • Optimization of Chemistry for a Vapour Phase Process for Defluxing No-Clean Lead Free Materials
  • Mark Routley, GEN3 Systems
  • Process Control of Ionic Contamination achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
  • Todd Rountree, Austin American Technology
  • Addressing the Problems with Ionic Cleanliness Testing Modern Circuits

Wednesday, May 24, 2017

Wednesday Keynote Address

Rudiger Knofe, Siemens AG
Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal

Session 4: Conformal Coating Materials and Processes

  • Helmut Schweigart, Ph.D. ZESTRON
  • Selection of Protective Measures against Climatic Stress
  • David Foote, Nordson March
  • Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures without Impact on Coating Performance
  • Marie Kaing, Humiseal
  • Conformal Coating Materials for High Temperature Automotive Applications
  • Rakesh Kumar, Ph.D., Specialty Coatings
  • Challenges of Designing Electronics for Conformal Insulation to Enhance their Protection and Reliability
  • Eva Rogge, Euro Plasma
  • Innovative Plasma Coatings for High Volume Conformal Coating of Electronics
  • Michael Szuch, Nordson Asymtek
  • Transitioning from Manual to Automated Conformal Coating
  • Mathieu Gonsolin, Exelsius
  • Air Plasma at Atmospheric-Pressure for Improving Conformal Coating Reliability

 

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