Yamaha IM America, Trans‐Tec introduce new SMT assembly technology at IPC/APEX 2016
Yamaha IM America, in partnership with Trans‐Tec Worldwide, will exhibit dynamic new SMT assembly technology in booth #1351 at the upcoming IPC/APEX 2016 exhibition and conference March 15‐17 2016. On exhibit for the first time will
be the new High‐Efficiency modular YSM20W mounter, offering the largest PCB handling capability in the industry and the world’s highest speed in its class, and the new Sigma F8S modular mounter.
The High‐Efficiency Modular YSM20W mounter is a much wider version of the YSM20, offering large PCB handling capability (L 1200 x W 742 work area (47.24” x 29.2”). It offers the world’s highest speed in its class ‐ 90,000 CPH / 63,500 CPH (IPC9850), and also large component capability (03015 mm to 55x100x28 mm). A maximum feeder count of 140 types minimizes lost time for changeovers and makes processing more efficient.
The new Sigma F8S delivers an average 5% improvement in
productivity (TAKT time) over previous F8 models, and is more
durable. It features an improved XY Axis utilizing the latest linear motor technology, and achieves even lower vibration through weight reduction and the adoption of cancellation‐type linear motors.
Other equipment in the booth will include the YSP/YCP10 Printer, the YSM20 single beam and YSM20 dual beam modular mounters, the YSiV AOI and YC8 Odd‐Form placement systems, and the Sigma G5S modular mounter. The Yamaha/Trans‐Tec booth is #1351, at the Las Vegas Convention Center, in South Hall 1.
Show visitors can stop by the booth to set up appointments for individual equipment demonstrations.