Yamaha to introduce latest, most advanced mounter and inspection systems at SMT Hybrid Packaging 2016
Wide-body mounter extends High-Efficiency Modular advantages into large-board assembly; TypeHS AOI system brings 3D-inspection speed boost
At SMT Hybrid Packaging 2016 in Nuremberg, April 26-28, Yamaha Motor IM Europe will debut new surface-mount placement and inspection systems that introduce advanced features for faster and more flexible assembly.
High-Efficiency Modular Mounter Beefs Up for Bigger Boards
The new Z:LEX YSM20W wide-body mounter populates larger, heavier boards at speeds up to 80,000 cph, with all the flexibility of the popular Z:LEX YSM20 High-Efficiency Modular system. By handling boards up to 810mm long x 742mm wide and 8mm thick, with conveyable weight up to 10kg, the new machine empowers assemblers to tackle technically ambitious projects that demand capabilities beyond the ordinary. Z:LEX YSM20W is the ideal platform for taking on the most advanced challenges coming from today’s automotive, industrial, medical, power or LED-lighting sectors.
The outstanding flexibility of the new mounter also extends to handling boards up to 810mm x 356mm in dual-lane configuration. Owners can thus gain a competitive edge through the ability to build larger assemblies at throughput rates usually associated with small mobile projects.
Inspection Boost for High Speed with High Confidence
The new YSi-V 12M TypeHS optical inspection system raises the performance bar, with enhanced features and the fastest 3D tact time in Yamaha’s range. Its arrival enables assemblers to maximise defect detection without trading cycle time as shrinking component sizes, increasing placement density and fine-pitch interconnects demand combined 3D, 2D and multi-angle inspection for optimum confidence. Other upgrades in the YSi-V 12M TypeHS include an improved image-processing subsystem, as well as more responsive four-direction image capturing for superior shape detection.
The arrival of the YSi-V 12M TypeHS strengthens manufacturers’ ability to implement all-item in-line inspection in high-volume production. With this new machine added to the line-up, customers can now choose from six different AOI system specifications to select the optimum feature set, inspection speed, and 12Mpixel or 5Mpixel resolution to suit a wide variety of budgets and manufacturing scenarios.
An additional bonus comes in the form of Yamaha’s new iProDB inspection history management software, which is available on request, free of charge, to all users of YSi-V AOI systems. iProDB leverages Yamaha’s position as a full-line manufacturer of surface-mount equipment to combine inspection data with status information from mounters and printers in the same line, to help with design for manufacture, process improvement, production management, and equipment maintenance.
The new machines will be displayed at the Yamaha Motor IM booth, 7-220, at SMT Hybrid Packaging 2016 in Nuremberg from April 26-28. Here, visitors can also discuss configurations, support, and Yamaha’s unique risk-free purchase facilities with technical experts and sales representatives.