YINCAE to Exhibit at IMAPS 2017 – 2 months away

YINCAE to Exhibit at IMAPS 2017 – 2 months away

VISIT YINCAE Booth # 416

 October 10 – 11, 2017


IMAPS New England 50th Symposium & Expo is 2 months away! The tradeshow will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th. The exhibiting YINCAE team will be available to answer questions and introduce innovative ways YINCAE materials may be of great benefit to current and future projects.


Dr. Wusheng Yin, YINCAE Advanced Materials, LLC. will be presenting his latest white paper, “High Reliability and High Throuput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive.” As pitch and solder ball size continue to shrink, reliability begins to decline rapidly.  Currently, the industry has adapted traditional; methods such as capillary underfilling and corner or edge bonding. However, as miniaturization continues, even these methods are creating a bottleneck.


YINCAE has developed solder joint encapsulants adhesives for ball bumping applications to eliminate this bottlenecking and allow miniaturization to continue while improving reliability, thermal cycling performance, drop test performance, and mechanical strength.



If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.


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