SMT Hybrid Packaging 2018 videos

SMT Hybrid Packaging 2018 – This year’s show, was held on June 5-7th at the Messecentrum in Nuremberg, Germany, offers a holistic view of systems integration in electronics manufacturing and microelectronics. Once again, Global SMT & Packaging featured a full program PCB – printed circuit board assemble / electronics manufacturing of Panel Discussions in the Forum Area in Hall 4, Stand 520.

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