Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar


When: June 30, 2016 @ 2:30 pm – 4:00 pm
Where: Online Webinar
Cost: €90 (Euro)
Contact: Philip O’Rourke
+353(0)86 806 1998

smtart-logoBall Grid Array packages have been used in the industry for many years. Just like surface mount, the use of BGA’s can affect printed board layout, assembly, inspection and repair process. BGA’s do however provide significant advantages over fine pitch components particularly in terms of process assembly yield. Correct design, printing and profiling is necessary to obtain the highest yields and reliably interconnection. To increase robustness and long term reliability underfill and corner bumping with adhesives have become popular and is also a design consideration
BGAbannerEveryone blames the BGA if failure occurs often because you can’t see under the package but is it the real failure mode. Bob produced the first video tape and interactive CD-ROM on BGA technology, practical advice is what you get on any of Bobs’ sessions supported by unique video clips to make the session come alive. All staff involved in the process of area array soldering with tin/lead and lead-free BGA assembly processes; including procurement, design engineers, reliability, quality personnel, failure analysts, and management involving is setting standards, inspection and product assessment of boards containing BGA, CSP, LGA and other area array components

The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar.Information on webinars, how to get the most out of a session and the requirements Click Here

Booking form for this event Click Here

Topics include:

Design rules
Printed board layout
Underfill and corner bumping benefits
Surface finish selection
Inspection/assembly marks
Assembly process
Rework procedures
BGA failures, Package cracking, Solder balls, Misalignment, Non reflow
Inspection criteria

Cost: €90 (Euro) Member €125 (Euro) Non Member

Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or

Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account


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