Developments in Advanced HDI Technology & Embedded Systems workshop

“Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland

When: Back to CalendarSeptember 14, 2016 (all-day)
Where: Tyndall, Cork
Cost: €125 for members €250 non member
Contact: Phillip O’Rourke
+353 (0)86 8061998

This workshop will look at the latest developments in Advanced High Density Interconnect. A HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology. A HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. The workshop will also look at embedded systems is acomputer system with a dedicated function within a larger mechanical or electrical system, often with real-time computing constraints.  It is embedded as part of a complete device often including hardware and mechanical parts. Embedded systems control many devices in common use today. 98 percent of all microprocessors being manufactured are used in embedded systems

Papers and studies  will be presented by EMC, Cork, together with Tyndall National Institute, Cork.

Facility Tour included with the workshop.


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