FREE Electronics Academy Webinar Series

Learn from the experts - free webinar

FREE Electronics Academy Webinar Series

Vision Engineering, a global manufacturer of innovative stereo and digital microscopes for multiple industries including electronics, will host a second series of live webinars presented by expert speaker Bob Willis, a globally-recognized expert in surface mount and area array technology.

The Electronics Academy Webinar Series will provide a better understanding of the PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture.

The Electronics Academy Webinar Series takes an in-depth look at the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. Understand the common causes of solder joint failure and learn how to identify and rectify process defects – improving quality and reducing costs.

  • Learn expert tips to identify quality issues
  • Understand the common causes of solder joint failure
  • A convenient and quick way to update your skills

Thursday 15th September – Crimp Connector Inspection & Quality Control
Wednesday 12th October – Printed Circuit Board Inspection & Quality Control
Thursday 10th November – Inspection of Conductive Adhesive Joints

Optical inspection is central to the understanding and improvement of quality control issues in the electronics industry. Vision Engineering’s ergonomic inspection solutions have helped tens of thousands of electronics manufacturers worldwide improve their processes – and save money.


Crimp Connector Inspection & Quality Control

Crimp Connector Inspection & Quality Control

Thursday 15th September 2016UK 2.30pm BST
Europe 3.30pm CET
USA 9.30am EST

  • Find out how to inspect wire and crimp terminations
  • Learn how to set-up inspection standards
  • Identify common defects and corrective actions

Billions of crimp joints are produced every year and are used in many high reliability applications. Care in the preparation and achieving IPC, MOD and other international standards are vital.

During this webinar, industry-expert Bob Willis will cover the inspection of wire and crimp terminations, setting up of inspection standards, operator training and certification as well as the common process defects and corrective actions.

Places are limited so sign-up now!

Have a question for Bob?  There will be time for a Q&A session at the end of the webinar.

Can’t make the webinar? All registrants receive a copy of the presentation slides.


Printed Circuit Board Inspection & Quality Control

Printed Circuit Board Inspection & Quality Control

Wednesday 12th October 2016UK 2.30pm BST
Europe 3.30pm CET
USA 9.30am EST

  • Learn about different PCB types
  • Find how to identify common problems
  • Understand the causes of product failure

A printed circuit board is the building block of any electronic assembly and as such must exceed specification and be totally compatible with the assembly processes used in modern assembly. Failures on PCBs can be cosmetic, often the most common reason for rejection in manufacture or assembly.

During this webinar, industry-expert Bob Willis will cover PCB types, packaging for good solderability and identification of common problems that can lead to assembly issues and possible product failure.

Places are limited so sign-up now!

Have a question for Bob? There will be time for a Q&A session at the end of the webinar.

Can’t make the webinar? All registrants receive a copy of the presentation slides.


Inspection of Conductive Adhesive Joints

Inspection of Conductive Adhesive Joints

Thursday 10th November 2016UK 2.30pm BST
Europe 3.30pm CET
USA 9.30am EST

  • Learn about the use of conductive adhesive joints
  • Find out how to inspect, identify process defects and corrective actions
  • Learn from the experts to understand joint reliability and inspection criteria

Conductive joints have been used for many years in electronics but they have never achieved the same performance and widespread use. However, conductive joints can be very effective and perform in many demanding environments, but what inspection criteria is important?

During this webinar, industry-expert Bob Willis will cover the inspection conductive adhesive joints, inspection criteria, reliability of joints and common process defects and corrective actions.

Places are limited so sign-up now!

Have a question for Bob? There will be time for a Q&A session at the end of the webinar.

Can’t make the webinar? All registrants receive a copy of the presentation slides.


Previous webinars in the series include:


Future webinars in the series include:

  • Component inspection and recognition
  • Inspection of underfill and staked components
  • Solder paste and stencil inspection
  • Microsection inspection
  • Destructive solder joint assessment and inspection

About Bob Willis

Bob Willis is a globally-recognised expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for the past 30 years.

He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the SMART Group Technical Committee, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.

Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers.

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