iNEMI Substrate & Package Technology Workshop

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SiP Module Moldability Project Webinar   
iNEMI Substrate & Package Technology Workshop

New Project: SiP Module Moldability Project
May 12 & 13

iNEMI invites you to join the SiP Module Moldability Project. Two call-for-participation webinars are scheduled to discuss the project background, objectives, scope and plan, as well as the sign-up steps. If you are interested in this project, please join us for one of the webinars. (Registration is free and required for planning purposes.)

Project Background

Project leaders:

  • Billy Ahn, STATS ChipPAC
  • Anthony Yang, CoreTech System Co., Ltd. (Moldex3D)

System-in-Package (SiP) technology is able to meet the increasing demands for smaller, thinner high-performance package solutions demanded by mobile, consumer and wearable devices. The technology also allows greater design flexibility and the potential to reduce cost and cycle time. However, SiP solutions can be complex and the density, combined with the complexity of components, can increase the risk of molding process. There needs to be a good understanding of the filling characteristics relative to the density of components and of the failure modes such as incomplete fill, void and solder bridges. This project is being organized to develop basic design rules based on mold flow simulation for a variety of cases with components having different geometries.

Two call-for-participation meetings are scheduled for May 12 & 13. Click here for additional background, including registration.

Substrate & Package Technology Workshop
May 26 & 27; Singapore

iNEMI invites you to our upcoming workshop in Singapore. This meeting will focus on advanced and emerging substrate and package technologies, with particular emphasis on assessing capabilities and identifying critical gaps. You will learn about some of the latest assembly and packaging technologies and how they will enable next-generation devices. Experts from the electronics manufacturing supply chain will discuss the latest developments in materials, equipment, assembly processes and package systems.

Click here for a full agenda and registration.


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