Measuring Component Solderability Webinar


Dear Customer:

Please join us for a FREE 1 hour webinar, held over the lunchtime hour, on measuring component solderability. In this informative webinar, we will guide you through the process for how to determine the solderability of component terminations and surfaces. If you want to learn how to determine if those “hard to find” parts or “last minute buy” components can be used in producing electronics assemblies, then you won’t want to miss this presentation!

The Signup is here:

: Thursday, June 23rd, 2016 from 11:30am to 12:30pm CST

Overview: Solderability is no longer an option for many high reliability segments of the world’s electronics assembly industry. With implementation of the new Rev. F of the IPC J-STD-001 document, solderability testing, gold removal, and component re-tinning have become prerequisites for doing business and remaining competitive in the global marketplace. This presentation focuses on the technical aspects of solderability testing and the component re-tinning process. Topics include:

  • Testing and measuring solderability
  • Gold embrittlement and removal of gold plating
  • RoHS and tin-lead component supply chain trends
  • Solderability testing protocols
  • MIL-STD-883 and J-STD-002 standards
  • SMT and through-hole component re-tinning
  • Legacy component refurbishing and RoHS to tin-lead conversion
  • GEIA-STD-0006 component re-tinning requirements
  • Coplanarity and solder thickness

At the end of the prepared webinar, there will be an open Q/A session. Participants will get a copy of the PowerPoint slides.

Please contact Alex Conley ( at 224-387-3256 with any questions.

The Signup is here:



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