New iNEMI Project Forming! Call for participation.

Don’t miss the call for participation for this upcoming iNEMI project: High-Temperature, Pb-Free Die Attach Material


High-Temperature, Pb-Free Die-Attach Material Project

Call for participation webinars scheduled: April 14, 2016

Project sign-up deadline is May 15, 2016

Project Background

Project leaders: Sze Pei Lim, Indium; Kinya Ichikawa, Intel

There is no single drop-in solution for high-temperature Pb-free material for die-attach that can replace current high-Pb options. In under-the-hood automotive applications, for example, higher junction temperatures are an issue, and these applications require higher reliability alloys that can fulfill stringent temperature cycling test (TCT) requirements.

This project plans to assess the processability and reliability of different Pb-free materials available for power semiconductor die-attach application on leadframe or ceramic substrates. Application targets include power MOSFET, IGBT modules, and integrated power modules. For more information, including instructions for joining, click here.

Call for Participation Meetings Scheduled

Two call for participation webinars are scheduled. The webinars will discuss the project objectives, scope and plan, as well as the sign-up steps. If you are interested in this project, please register for one of the times listed below. The webinar is free, but pre-registration is required for planning purposes. Once you are registered, you will receive a confirmation email with instructions for joining the meeting.

Webinar for Asia participants

Date: April 14, 2016
Time: 9:00 a.m. CST (China); 10:00 a.m. JST (Japan)
Register for this meeting

Webinar for North America and Europe participants:

Date: April 14, 2016
Time: 9:00 a.m. EDT (Eastern US); 3:00 CEST (Central Europe)
Register for this meeting

For additional information: Masahiro Tsuriya,

INEMI   2214 Rock Hill Road  Suite 110  Herndon,  VA




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