SMTA Webtorial: Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys
Robotic Iron and Laser Soldering for Lead-Free and High Temperature Alloys
Two (2) 90 minute Sessions
Tuesday, November 8 and Tuesday, November 15, 2016
Presented by: Bob Willis, Bobwillisonline.com & NPL National Physical Laboratory
When we start to talk about high temperature electronics it’s not the solder it’s all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200oC, however, there are many applications that have to work at much higher levels, up to 300oC. Typically the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used telecom and automotive producers with different cored wire combinations.
The webinar is a mixture or theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory . A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.
Topics may include:
- Oil, Gas, Space, Automotive & Military Applications
- Reference books, specification and standards
- Product temperature range
- Component compatibility
- PCB substrate choices & specifications and design
- Soldering alloy choices
- Assembly & soldering options
- Setting up and assessment of soldering systems
- Critical choice in the selection of cored wire for automated assembly
- Reliability assessment & testing results
- Failure modes
- Inspection of solder joints and new defect typesInstructor Bob Willis
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group Technical Committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis has provided training and consultancy in most areas of electronic manufacture for over 30 years.
Bob has conducted workshops and set up production lines, assembly features and his “NPL Process Advice and Defect Clinic” with all the major organisations and exhibition organisers worldwide like Productronica, Germany, IPC APEX, SMTAI in the USA plus National Electronics Week and Nepcon Electronics in UK.
Bob was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and was elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he has also worked on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers.
Bob organises the NPL Defects Database on behalf of NPL and organises the Electronics Interconnection Division’s monthly online technology webinars and on site workshops. He has authored two books in the last couple of years on Pin In Hole Intrusive, Design & Assembly plus Package On Package Design Assembly & Quality Control which has been read by over 2000 engineers from around the world.
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