ZESTRON Academy invites you to attend the Free Webinar “Is Cleaning Critical to POP Assemblies”

E16-04MY-ZESTRON-Webinar-Is Cleaning Critical to POP AssembliesZESTRON, the worldwide leader in high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce the third installment in the 2016 5-Part Cleaning Webinar Series titled “Is Cleaning Critical to POP Assemblies”. This free-of-charge webinar is scheduled for July 1 at 3:00 pm (MYT).
Mr. GT Yeoh, Senior Application Engineer, will present the 45 minute webinar that concludes a 15 minute Q & A session. 

What will you learn?

Cleaning is a critical process in the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper addresses the cleanliness level of package-on-package (PoP) assemblies, including underneath PoP components and in between packages.

Who should attend?

The webinars are designed for all interested parties and, in particular, production managers and operators, service and process engineers, quality assurance personnel and managers.

For more information or to register, please click here to visit our website or contact academy-malaysia@zestron.com


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