Global SMT TV – Broadcasting Schedule

All events are broadcast at: 7:30am PCT, 10:30am EST, 3:30pm GMT and 4:30pm CET

** All programs will be broadcast on

Automating the automatic inspection process

Inspection is performed at various points on the production line and acts as the eyes and ears of a data-driven decision process. For manufacturers seeking data-driven continuous improvement, where should they focus their efforts and what process parameters should they be measuring to improve their first pass yield. This panel will address many of these questions.

Making x-Ray part of the manufacturing process Inline X-Ray inspection continues to proliferate to address the growing number of BTC devices. What is the optimum confirguration for these systems and should they be supplemented with an at-line machine for in-depth troubleshooting. This panel will discuss the options.
Wave soldering do’s and don’ts There are still many companies making thru-hole boards for consumer applications, using wave soldering systems. Setting up these systems and controlling the batch chemistries is key towards achieving consistant and reliable interconnections. This panel will discuss best practices.

The challenges of manufacturing and testing 5G boards and chipsets

5G boards are heavier and more densely populated with a large number of chipsets and BTC devices. This panel will discuss the manufacturing challenges for producing reliable and sustainable 5G assemblies.

Town Hall Debate: A Supply chain in Crisis

The current supply chain is in crisis and has many ramifications for the electronics industry. What are all the issues and how will this play out? This esteemed panel will discuss the challenges and likely scenairios ahead.

Advanced print and paste deposition techniques

Solder and solder paste can be applied to materials using a variety of techniques, ranging from stencil printing, jetting, sintering and preforms to wafer-bumping, sputtering and direct die attach. This panel will discuss the variety of methods, their use cases and strengths and weaknesses. .

Cleanliness of PC assemblies and SIR testing techniques

Ensuring cleanliness consistency and the dependability of SIR testing results relies on a variety of factors including the substrate material, test coupon design, paste and coating used etc. This panel will discuss how to setup and optimize SIR test coupons to achieve accurate and repeatable results.

Automating the materials flow within the factory

The most common area for automation and optimization in the factory is the materials flow, using component storage towers, x-ray counting systems and AGV’s to deliver materials around the factory. The benefits are obvious – if you can maintain a tighter, more accurate control of your inventory, you can plan better, save money and reduce bottlenecks in your production. This panel will discuss some of the systems and methodologies to automate and optimize the materials flow.

The fundamentals of solder paste technology Solder is a critical interconnection material in the electronics manufacturing process. This panel will seek to provide a fundamental guide to all the characteristics that continue to make solder the interconnection of choice for todays PCB assemblies. This will include paste types, powder sizes, the role of flux chemistries, temperature and much more.

Effective test strategies for assembled boards

AOI, SPI, X-ray and end of line electrical test are constantly improving. This panel will discuss the latest innovations in test and how AI improves reliability and ultimately increases first-pass yield.

Potting, encapsulating and underfilling Choosing the correct material and managing dispensed materials involves many aspects. What are they key parameters, challenges and best practices. This panel will discuss the essential tips you need to know.
Low temperature solders – revisited Low Temperature Solders and Electrically Conductive Adhesives are taking on a new importance in the thermally-challenged world of EV and 5G. LTS is also expanding in the consumer industry as a low cost interconnection solution. This panel will discuss the latest advances.

Selective soldering do’s and don’ts

Bridging, webbbing and solder balls are all common defects in the selective soldering process. This panel will discuss how to avoid these and many more defects and process-related challenges.


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