Automating the automatic inspection process
Inspection is performed at various points on the production line and acts as the eyes and ears of a data-driven decision process. For manufacturers seeking data-driven continuous improvement, where should they focus their efforts and what process parameters should they be measuring to improve their first pass yield. This panel will address many of these questions.
The challenges of manufacturing and testing 5G boards and chipsets
5G boards are heavier and more densely populated with a large number of chipsets and BTC devices. This panel will discuss the manufacturing challenges for producing reliable and sustainable 5G assemblies.
Town Hall Debate: A Supply chain in Crisis
The current supply chain is in crisis and has many ramifications for the electronics industry. What are all the issues and how will this play out? This esteemed panel will discuss the challenges and likely scenairios ahead.
Advanced print and paste deposition techniques
Solder and solder paste can be applied to materials using a variety of techniques, ranging from stencil printing, jetting, sintering and preforms to wafer-bumping, sputtering and direct die attach. This panel will discuss the variety of methods, their use cases and strengths and weaknesses. .
Cleanliness of PC assemblies and SIR testing techniques
Ensuring cleanliness consistency and the dependability of SIR testing results relies on a variety of factors including the substrate material, test coupon design, paste and coating used etc. This panel will discuss how to setup and optimize SIR test coupons to achieve accurate and repeatable results.
Automating the materials flow within the factory
The most common area for automation and optimization in the factory is the materials flow, using component storage towers, x-ray counting systems and AGV’s to deliver materials around the factory. The benefits are obvious – if you can maintain a tighter, more accurate control of your inventory, you can plan better, save money and reduce bottlenecks in your production. This panel will discuss some of the systems and methodologies to automate and optimize the materials flow.
Effective test strategies for assembled boards
AOI, SPI, X-ray and end of line electrical test are constantly improving. This panel will discuss the latest innovations in test and how AI improves reliability and ultimately increases first-pass yield.
Selective soldering do’s and don’ts
Bridging, webbbing and solder balls are all common defects in the selective soldering process. This panel will discuss how to avoid these and many more defects and process-related challenges.